A Survey of AI-based smart chiplets and interconnects for vehicles

Abstract

The automotive industry is undergoing a significant transformation driven by advancements in artificial intelligence (AI) and semiconductor technology. Modern vehicles, equipped with sophisticated electronics, sensors, and computational capabilities, are evolving into complex cyber-physical systems. Central to this evolution are AI- based smart chiplets and interconnects, which are revolutionizing vehicle operations, communication, and interaction with the environment. This article provides an in-depth exploration of AI-based smart chiplets and interconnects for vehicles, examining their architecture, functionalities, benefits, challenges, and prospects. Key topics include sensor data processing, machine learning inference, high-speed communication protocols, and security features. The article also addresses the technical, regulatory, and ethical challenges associated with these technologies and highlights future trends such as advancements in AI, integration with emerging technologies, miniaturization, and collaborative ecosystems. The integration of AI-based smart chiplets and interconnects promises a new era of intelligent, connected, and autonomous vehicles, offering enhanced safety, performance, and user experiences.